Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapes
作者：
Ping Chen;Xiu-Chen Zhao;Ying Liu;Hong Li;Yong Wang
作者机构：
School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, 100081, China
Center of Packaging and Testing, Beijing Microelectronics Technology Institute, Beijing, 100076, China
语种：
英文
关键词：
Aging resistance - Bump shape - Change of environment - High temperature aging - Isothermal aging - Solder joint reliability - Solder process - Thickness growth
期刊：
RARE METALS
年：
2021
摘要：
The effects of bump shape on the aging resistance and mechanical properties of Sn3.0Ag0.5Cu (SAC) solder bump joints were investigated by high-temperature aging test and shear test. Three different SAC solder bump joints with barrel type, cylinder type, and hourglass type, respectively, were provided by controlling solder process. The results indicate that as the bump volume decreases from barrel bump to hourglass bump in the reflow, the thickness growth rate of intermetallic compounds (IMCs) between different solder joints and Cu substrates in the isothermal aging of 150 °C decreases. And the change of shear strength of hourglass interconnection solder joint with the increase in temperature is the minimum in the three interconnection solder joints. Thus, as the solder dosage decreases properly, hourglass interconnection solder joint is obtained, which is avail to enhance the solder joint reliability at the high-temperature aging and the ability to adapt to the change of environment temperature suddenly. ©2015 The Nonferrous Metals Society of China and Springer-Verlag Berlin Heidelberg
