Aging resistance and mechanical properties of Sn3.0Ag0.5Cu solder bump joints with different bump shapes
作者：
Chen, Ping;Zhao, Xiu-Chen;Liu, Ying;Li, Hong;Wang, Yong
通讯作者：
Xiu-Chen Zhao
作者机构：
School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, 100081
Center of Packaging and Testing, Beijing Microelectronics Technology Institute, Beijing, 100076
通讯机构：
School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
语种：
英文
期刊：
稀有金属(英文版)
ISSN：
1001-0521
年：
2021
卷：
40
期：
01
页码：
225-230
基金类别：
supported by the National Science and Technology Major Project of China
摘要：
The effects of bump shape on the aging resistance and mechanical properties of Sn3.0Ag0.5Cu (SAC) solder bump joints were investigated by high-temperature aging test and shear test. Three different SAC solder bump joints with barrel type, cylinder type, and hourglass type, respectively, were provided by controlling solder process. The results indicate that as the bump volume decreases from barrel bump to hourglass bump in the reflow, the thickness growth rate of intermetallic compounds (IMCs) between different solder joints and Cu substrates in the isothermal aging of 150 °C decreases. And the change of shear strength of hourglass interconnection solder joint with the in...
